1407
Foreword
Sinn-wen Chen, Srinivas Chada, Chih-ming Chen, A. Lindsay Greer and Young-chang Joo, et al.
1408-1414
Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon
T.K. Tsai, S.S. Wu, W.L. Liu, S.H. Hsieh and W.J. Chen
1415-1428
Open AccessPhase Equilibria in the Ag-Ni-Sn System: Isothermal Sections
Clemens Schmetterer, Hans Flandorfer, Klaus W. Richter and Herbert Ipser
1429-1441
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System
X. J. Liu, C. P. Wang, F. Gao, I. Ohnuma and K. Ishida
1442-1447
Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process
Sung-Ki Lee, Jae-Ho Lee and Young-Ho Kim
1448-1454
Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness
Min-Hsien Lu and Ker-Chang Hsieh
1455-1461
Cross-Interaction between Ni and Cu across Sn Layers
with Different Thickness
Chien Wei Chang, Su Chun Yang, Chun-Te Tu and C. Robert Kao
1462-1468
Evaluation of DC-sputtered Glassy TaCoN Thin Film for Copper Metallization
Jau-Shiung Fang, Min-Li Ke and Hui-Chien Chen
1469-1475
Morphological and Microstructural Evolution
of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM
Solder Joint
Yung-Chi Lin, Toung-Yi Shih, Shih-Kang Tien and Jenq-Gong Duh
1476-1482
Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints
Li-Yin Hsiao, Guh-Yaw Jang, Kai-Jheng Wang and Jenq-Gong Duh
1483-1488
Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H2 Plasmas for Flip-Chip Bumping
Yung-Sen Lin, Chun-Hao Chang and Wei-Jhih Lin
1489-1494
Fabrication of Mg-Based Intermetallic Compounds
by Liquid Electromigration
C.H. Li, Y.C. Chuang and C.Y. Liu
1495-1500
The Effect of Thermomigration on Phase Coarsening
in a Eutectic SnPb Alloy
Y.C. Chuang and C.Y. Liu
1501-1509
Effects of Minor Additions of Zn on Interfacial Reactions
of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging
Moon Gi Cho, Sung K. Kang, Da-Yuan Shih and Hyuck Mo Lee
1510-1515
Fabrication of Ni Metal Mask by Electroforming Process
Using Wetting Agents
Jun Hyung Lim, Eui Cheol Park, Seung Yi Lee, Jeong-Won Yoon and Sang-Su Ha, et al.
1516-1523
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications
Jenn-Ming Song, Hsin-Yi Chuang and Zong-Mou Wu
1524-1530
Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder
with Cu, Ag, and Ni Substrates
Ching-Feng Yang, Sinn-Wen Chen, Kuan-Hsien Wu and Tsung-Shune Chin
1531-1535
Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution
Chih-Yao Liu, Ying-Ru Chen, Wang-Long Li, Min-Hsiung Hon and Moo-Chin Wang
1536-1544
Thermodynamic Assessment of the Ni-Bi Binary System
and Phase Equilibria of the Sn-Bi-Ni Ternary System
Sun-Kyoung Seo, Moon Gi Cho and Hyuck Mo Lee