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Volume 1 / 1972 - Volume 41 / 2012
99-104
Regular Issue Paper
InAlSb/InAs/AlGaSb Quantum Well Heterostructures for High-Electron-Mobility Transistors
Brian R. Bennett, J. Brad Boos, Mario G. Ancona, N. A. Papanicolaou and Graham A. Cooke, et al.
105-109
Wafer-Lever Hermetic Package with Through-Wafer Interconnects
Wang Yu-Chuan, Zhu Da-Peng, Xu Wei and Le Luo
110-116
Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints
Shane Loo, Xueren Zhang, Hun Shen Ng, Tong Yan Tee and S. G. Mhaisalkar
117-122
Local Melting during Electromigration in Cu Conductor Lines
H. Zhang, G. Wang and G. S. Cargill
123-128
Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias
Kwang-Yong Lee, Teck-Su Oh, Jae-Ho Lee and Tae-Sung Oh
129-135
Structural and Passivative Behaviors of Cu(In) Thin Film
J. S. Fang and H. Y. Hsieh
136-146
Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System
H. Yu, V. Vuorinen and J. K. Kivilahti
147-158
Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples
Yee-Wen Yen, Chien-Chung Jao, Hsien-Ming Hsiao, Chung-Yung Lin and Chiapyng Lee
159-167
Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing
S.W. Liang, Y.W. Chang and Chih Chen
168-172
Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint
Chih-Ming Chen, Long-Tai Chen and Ya-Shiu Lin
173-178
Special Issue Paper
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C
Tia-Marje K. Korhonen, Lawrence P. Lehman, Matt A. Korhonen and Donald W. Henderson
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