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Volume 1 / 1972 - Volume 41 / 2012
539-542
Characteristics of Dislocation Half-Loop Arrays in 4H-SiC Homo-Epilayer
Z. Zhang, R.E. Stahlbush, P. Pirouz and T.S. Sudarshan
543-548
Strategies to Improve Field Emission Performance of Nanostructural ZnO
C. X. Xu and X. W. Sun
549-554
Regular Issue Paper
High Performance Nonconductive Film with π -Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications
Yi Li, Myung Jin Yim and C.P. Wong
555-561
Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds
D. Wu, T.A. Lograsso and J.W. Anderegg
562-567
In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation
Min-Seung Yoon, Min-Ku Ko, Oh-Han Kim, Young-Bae Park and William D. Nix, et al.
568-577
Thermodynamic Modeling of the Au-Bi-Sb Ternary System
J. Wang, F.G. Meng, H.S. Liu, L.B. Liu and Z.P. Jin
578-586
Interfacial Reactions between Cu x Ni y Alloy Underbump Metallurgy and Sn-Ag- z Cu Solders
H. HAN, Y. C. SOHN and JIN YU
587-592
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding
Chun-Mei Li, Ping Yang, De-Ming Liu, Ngar-Chun Hung and Ming Li
593-597
Magnetic Nanocomposite for Potential Ultrahigh Frequency Microelectronic Application
Hai Dong, Adam Meininger, Hongjin Jiang, Kyoung-Sik Moon and C. P. Wong
598-605
Measurement of Small Specific Contact Resistance of Metals with Resistive Semiconductors
Deepak and Hare Krishna
606-613
Effects of Substrate Materials on Self-Formation of Ti-Rich Interface Layers in Cu(Ti) Alloy Films
K. Ito, S. Tsukimoto, T. Kabe, K. Tada and M. Murakami
614-622
Barrier Properties of Amorphous Binary Ta-Ni Thin Films for Cu Interconnection
J.S. Fang, T.P. Hsu and H.C. Chen
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