1
Foreword
Fu Guo, K.N. Subramanian, Sung Kang, Srinivas Chada and Laura Turbini, et al.
2-8
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hu Hao, Yaowu Shi, Zhidong Xia, Yongping Lei and Fu Guo
9-16
Reliability of Conductive Adhesives as a Pb-free Alternative
in Flip-Chip Applications
Jong-Woong Kim, Young-Chul Lee and Seung-Boo Jung
17-22
Tin Whisker Growth Induced by High Electron Current Density
Y. W. Lin, Yi-Shao Lai, Y. L. Lin, Chun-Te Tu and C. R. Kao
23-31
Modeling Material Properties of Lead-Free Solder Alloys
Zhanli Guo, Nigel Saunders, Peter Miodownik and Jean-Philippe Schillé
32-39
The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-
x
Ni
Tina Ventura, Christopher M. Gourlay, Kazuhiro Nogita, Tetsuro Nishimura and Michel Rappaz, et al.
40-44
Interfacial Reactions in the Sn-Bi/Te Couples
Chen-nan Chiu, Chao-hong Wang and Sinn-wen Chen
45-50
Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates
Feng Gao, Hiroshi Nishikawa and Tadashi Takemoto
51-60
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys
C.M. Gourlay, J. Read, K. Nogita and A.K. Dahle
61-72
Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging
K.K. Hong, J.B. Ryu, C.Y. Park and J.Y. Huh
73-83
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
Yee-Wen Yen, Weng-Ting Chou, Yu Tseng, Chiapyng Lee and Chun-Lei Hsu
84-89
Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates
Han-Byul Kang, Jee-Hwan Bae, Jae-Wook Lee, Min-Ho Park and Jeong-Won Yoon, et al.
90-95
Can Whiskers Grow on Bulk Lead-Free Solder?
John A. Nychka, Yan Li, Fuqian Yang and Rong Chen
96-101
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
Y.L. Lin, Y.S. Lai, Y.W. Lin and C.R. Kao
102-109
Open AccessMechanical Size Effects in Miniaturized Lead-Free Solder Joints
Peter Zimprich, Usman Saeed, Agnieszka Betzwar-Kotas, Brigitte Weiss and Herbert Ipser
110-117
Demonstration and Characterization of Sn-3.0Ag-0.5Cu/
Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
Yun-Hwan Jo, Joo Won Lee, Sun-Kyoung Seo, Hyuck Mo Lee and Hun Han, et al.
118-124
Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows
Ja-Myeong Koo, Bui Quoc Vu, Yu-Na Kim, Jong-Bum Lee and Jong-Woong Kim, et al.
125-133
Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature
Dong-Xia Xu, Yong-Ping Lei, Zhi-Dong Xia, Fu Guo and Yao-Wu Shi