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Open AccessCompliant Substrates for Heteroepitaxial Semiconductor Devices: Theory, Experiment, and Current Directions
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Air-Gaps for High-Performance On-Chip Interconnect Part I: Improvement in Thermally Decomposable Template
SeongHo Park, Sue Ann Bidstrup Allen and Paul A. Kohl
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Open AccessAir-Gaps for High-Performance On-Chip Interconnect Part II: Modeling, Fabrication, and Characterization
Seongho Park, Sue Ann Bidstrup Allen and Paul A. Kohl
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Open AccessInterface Engineering and Direct Bonding of Lithium Tantalate Crystals
Ilya Torchinsky and Gil Rosenman
1552-1559
Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits
Di Liang, Alexander W. Fang, Hyundai Park, Tom E. Reynolds and Keith Warner, et al.
1560-1564
Growth and Characterizations of GaN-Based LEDs Grown on Wet-Etched Stripe-Patterned Sapphire Substrates
Kar Wei Ng, Jung Min Hwang and Kei May Lau
1565-1573
Effect of Ar+ Radiofrequency Plasma Treatment Conditions
on the Interfacial Adhesion Energy Between Atomic-Layer-Deposited Al2O3 and Cu Thin Films in Embedded Capacitors
Sung-Cheol Park and Young-Bae Park
1574-1579
Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste
Xu Chen, Rong Li, Kun Qi and Guo-Quan Lu
1580-1590
Theoretical Prediction and Experimental Measurement of the Degree of Cure of Anisotropic Conductive Films (ACFs) for Chip-On-Flex (COF) Applications
Chang-Kyu Chung, Yong-Min Kwon, Il Kim, Ho-Young Son and Kyo-Sung Choo, et al.
1591-1597
Analysis and Experimental Verification of the Volume Effect
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S.C. Yang, Y.W. Wang, C.C. Chang and C.R. Kao
1598-1604
Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging
V. Sivasubramaniam, N.S. Bosco, J. Janczak-Rusch, J. Cugnoni and J. Botsis
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Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface
Chih-Ming Chen, Chih-Hao Chen, Chi-Pu Lin and Wen-Chiung Su
1611-1617
Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich
Shih-Ming Kuo and Kwang-Lung Lin
1618-1623
Open AccessLarge-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Julien Sylvestre and Alexandre Blander
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Electromigration Reliability and Morphologies of Cu Pillar
Flip-Chip Solder Joints with Cu Substrate Pad Metallization
Yi-Shao Lai, Ying-Ta Chiu and Jiunn Chen
1631-1639
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Ning Zhang, Yaowu Shi, Zhidong Xia, Yongping Lei and Fu Guo, et al.
1640-1647
A Comparative Study of Reactive Wetting of Lead
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Hongqin Wang, Hui Zhao, Dusan P. Sekulic and Yiyu Qian
1648-1652
Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes
Jun-Ho Lee, Jun Suk Oh, Pyong Chan Lee, Dong Ouk Kim and Youngkwan Lee, et al.