1653-1656
Open AccessImproved Uniformity and Electrical Performance of Continuous-Wave Laser-Crystallized TFTs Using Metal-Induced Laterally Crystallized Si Film
Chih-Pang Chang and YewChung Sermon Wu
1657-1664
Growth and Structural Characterization of Spherical Silicon Crystals Grown from Polysilicon
Majid Gharghi and Siva Sivoththaman
1665-1673
Complex Refractive Indices of CdxZn1−xO Thin Films Grown by Molecular Beam Epitaxy
J.W. Mares, M. Falanga, W.R. Folks, G. Boreman and A. Osinsky, et al.
1674-1680
Simultaneous Formation of Ni/Al Ohmic Contacts
to Both n- and p-Type 4H-SiC
Kazuhiro Ito, Toshitake Onishi, Hidehisa Takeda, Kazuyuki Kohama and Susumu Tsukimoto, et al.
1681-1685
Incomplete Energy Transfer in PVK:OPA3008:MEH-PPV Blends
Su-Hua Yang, Po-Shou Chuang and Wen-Kai Chang
1686-1690
Absorption Properties of Hybrid SnO2 Nanocrystal-Carbon Nanotube Structures
Ganhua Lu, Ming Liu, Kehan Yu and Junhong Chen
1691-1697
A Paradigm of Carbon Nanotube Interconnects
in Microelectronic Packaging
Yangyang Sun, Lingbo Zhu, Hongjin Jiang, Jiongxin Lu and Wei Wang, et al.
1698-1709
Nanoclay Paste as a Thermal Interface Material for Smooth Surfaces
Chuangang Lin and D.D.L. Chung
1710-1720
Kinetics of Diffusion-Induced Recrystallization in the Cu(Ni) System at Low Temperatures
Y. Yamamoto and M. Kajihara
1721-1726
Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints
X. Gu and Y.C. Chan
1727-1733
Phase Equilibria of the Sn-V System and Interfacial Reactions
in Sn/V Couples
Chih-Chi Chen, Wojcieh Gierlotka and Sinn-Wen Chen
1734-1741
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
T.H. Chuang, C.C. Jain and H.M. Wu
1742-1750
Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers
Cheng-Li Chuang, Jong-Ning Aoh, Qing-An Liao, Chun-Chieh Hsu and Shi-Jie Liao, et al.
1751-1755
In Situ
Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements
Wei Min Xiao, Yao Wu Shi, Yong Ping Lei, Zhi Dong Xia and Fu Guo
1756
Erratum
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Ning Zhang, Yaowu Shi, Zhidong Xia, Yongping Lei and Fu Guo, et al.