231-239
Space Charge and Carrier Trapping Effects on the Transient Photocurrents of Organic Materials Using the Time-of-Flight Technique
P. Cusumano and S. Gambino
240-244
Fabrication of Strained-Si/Strained-Ge Heterostructures
on Insulator
Leonardo Gomez, Michael Canonico, Meekyung Kim, Pouya Hashemi and Judy L. Hoyt
245-248
Silicidation of Ni(Yb) Film on Si(001)
Jia Luo, Yu-Long Jiang, Guo-Ping Ru, Bing-Zong Li and Paul K. Chu
249-263
Stress-Induced Grain Boundary Migration in Polycrystalline Copper
Max O. Bloomfield, Daniel N. Bentz and Timothy S. Cale
264-278
Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems
Vincent Grolier and Rainer Schmid-Fetzer
279-287
Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification
F. Gao, C.P. Wang, X.J. Liu and K. Ishida
288-299
Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-
x
Bi Solders and Cu
M. He and V.L. Acoff
300-306
Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
Min He, Sylvester N. Ekpenuma and Viola L. Acoff
307-313
Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability
Xiaoqin Lin and Le Luo
314-323
Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders
Yoshikazu Takaku, Lazuardi Felicia, Ikuo Ohnuma, Ryosuke Kainuma and Kiyohito Ishida
324-330
Ambient Temperature Ultrasonic Bonding of Si-Dice
Using Sn-3.5wt.%Ag
Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou and Jong-Young Kim
331-338
Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys
Min Pei and Jianmin Qu
339-346
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder
Yao Yao, Semyon Vaynman, Leon M. Keer and Morris E. Fine
347-354
Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders
T. Chen and I. Dutta
355-360
Epitaxial Growth and Surface Roughness Control
of Ferromagnetic Thin Films on Si by Sputter Deposition
Jianhua Joshua Yang, C.-X. Ji, Ying Yang, Hua Xiang and Y. A. Chang
361-367
Wet Etching Study of La0.67(Sr0.5Ca0.5)0.33MnO3 Films
on Silicon Substrates
Joo-Hyung Kim, Alexander M. Grishin and Velislava Angelova Ignatova
368-372
The Effect of Hydrogen on the Fracture Properties of
0.8(Na1/2Bi1/2)TiO3-0.2(K1/2Bi1/2)TiO3 Ferroelectric Ceramics
H. Zhang, Y.J. Su, L.J. Qiao, W.Y. Chu and D. Wang, et al.