373
Foreword
N.M. Ravindra
374-378
Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices
Rene D. Rivero, Sudhakar Shet, Michael R. Booty, Anthony T. Fiory and Nuggehalli M. Ravindra
379-383
Morphology of Thick SiC Epitaxial Films Grown by the Physical Vapor Transport Method
B.P. Wagner, N.B. Singh, A. Berghmans, D.J. Knuteson and D. Kahler, et al.
384-387
Microwave Performance of AlGaN/GaN High-Electron-Mobility Transistors on Si/SiO2/Poly-SiC Substrates
T.J. Anderson, F. Ren, J. Kim, J. Lin and M. Hlad, et al.
388-395
Luminescence of Long-Term Ordered Pure and Doped Gallium Phosphide
Sergei Pyshkin, John Ballato, Michael Bass and Giorgio Turri
396-402
Relationship of Band-Edge Luminescence to Recombination Lifetime in Silicon Wafers
R.K. Ahrenkiel, S.W. Johnston, W.K. Metzger and P. Dippo
403-416
Platinum and Rhodium Silicide–Germanide Optoelectronics
M.P. Lepselter, A.T. Fiory and N.M. Ravindra
417-428
Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints
W.H. Bang, M.-W. Moon, C.-U. Kim, S.H. Kang and J.P. Jung, et al.
429-438
Analysis of Barrier Defects in Low-
k
/Cu Interconnects Based on Electrochemical Response and Simulation Cell
Dong Mei Meng, Nancy L. Michael, Young-Joon Park and Choong-Un Kim
439-447
Practical Surface Treatments and Surface Chemistry of
n
-Type and
p
-Type GaN
J.J. Uhlrich, L.C. Grabow, M. Mavrikakis and T.F. Kuech
448-461
Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability
Yasuhiro Aoyagi and D.D.L. Chung
462-468
Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive
Masahiro Inoue, Hiroaki Muta, Takuji Maekawa, Shinsuke Yamanaka and Katsuaki Suganuma
469-476
Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing
B.Y. Wu, M.O. Alam, Y.C. Chan and H.W. ZHONG
477-482
Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations
Rong An, Chunqing Wang, Yanhong Tian and Huaping Wu
483-489
Effect of Oxidation on Indium Solderability
Jongman Kim, Harry Schoeller, Junghyun Cho and Seungbae Park
490-497
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
E. Sandnes, M.E. Williams, M.D. Vaudin and G.R. Stafford
498-506
Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys
Shih-Kang Lin, Ching-Feng Yang, Shyr-Harn Wu and Sinn-Wen Chen
507-514
Creep Properties of Composite Solders Reinforced
with Nano- and Microsized Particles
Yaowu Shi, Jianping Liu, Yanfu Yan, Zhidong Xia and Yongping Lei, et al.
515-522
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder
S.M.L. Nai, J. Wei and M. Gupta
523-526
Direct Fabrication of Fine Gold Patterns from an Aqueous Solution by a UV Laser
Abbu Udaiyar Senthil Kumaran and Masaya Ichimura
527-534
Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process
Bae-Kyun Kim, Seong-Jae Lee, Jong-Yun Kim, Kum-Young Ji and Yeo-Joo Yoon, et al.
535-539
Characterization of Ge22Sb22Te56 and Sb-Excess Ge15Sb47Te38 Chalcogenide Thin Films for Phase-Change Memory Applications
Sang-Ouk Ryu
540-544
Memory Switching Characteristics in Amorphous Ga2Se3 Films
A.E. Bekheet