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Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures
T.-S. Park, M. Dao, S. Suresh, A.J. Rosakis and D. Pantuso, et al.
792-805
Open AccessFormation of Intermetallic Compounds Between Liquid Sn
and Various CuNi
x
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V. Vuorinen, H. Yu, T. Laurila and J.K. Kivilahti
806-814
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound
Seishi Kumamoto, Hitoshi Sakurai, Youichi Kukimoto and Katsuaki Suganuma
815-828
Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System
as a Basis for Ternary Diffusion Soldering
Vincent Grolier and Rainer Schmid-Fetzer
829-836
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
E.H. Wong, C.S. Selvanayagam, S.K.W. Seah, W.D. van Driel and J.F.J.M. Caers, et al.
837-844
Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders
Wenming Tang, Anqiang He, Qi Liu and Douglas G. Ivey
845-851
Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging
T.I. Shih and J.G. Duh
852-859
Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films
C.S. Hsu, H.Y. Hsieh and J.S. Fang
860-866
Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route
P. Babaghorbani and M. Gupta
867-873
The Shear Strength and Fracture Behavior of Sn-Ag-
x
Sb
Solder Joints with Au/Ni-P/Cu UBM
Hwa-Teng Lee, Shuen-Yuan Hu, Ting-Fu Hong and Yin-Fa Chen
874-879
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy
Ping Liu, Pei Yao and Jim Liu
880-886
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
Luhua Xu, John H. L. Pang and Faxing Che
887-893
Electromigration of Sn-9wt.%Zn Solder
Yu-Min Hung and Chih-Ming Chen
894-900
Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints
Min-Na Chen, Shi-Jin Ding, Qing-Qing Sun, David Wei Zhang and Li-Kang Wang
901-904
Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs
Kartika Chandra Sahoo, Chun-Wei Chang, Yuen-Yee Wong, Tung-Ling Hsieh and Edward Yi Chang, et al.
905-911
a-Si:C:H and a-Si:N:H Thin Films Obtained by PECVD
for Applications in Silicon Solar Cells
T. Stapinski and B. Swatowska
912-916
Magneto-transport Properties of a GaMnAs-Based Ferromagnetic Semiconductor Trilayer Structure Grown on a ZnMnSe Buffer
S.J. Chung, D.Y. Shin, Hyungchan Kim, Sanghoon Lee and X. Liu, et al.
917-924
Structural and Chemical Comparison of Graphite and BN/AlN Caps Used for Annealing Ion Implanted SiC
K.A. Jones, M.C. Wood, T.S. Zheleva, K.W. Kirchner and M.A. Derenge, et al.
925-929
Preparation and Characterization of Polyimide/Zirconia Composite Films
Sea-Fue Wang, Yuh-Ruey Wang, Kuo-Chung Cheng, Jyh-Herng Chen and Yu-Ping Hsaio
930-934
Electrical Conductivity, Thermoelectric Power,
and Optical Properties of Organo-Soluble
Polyaniline Organic Semiconductor
Fahrettin Yakuphanoglu, Bahİre Fİlİz Şenkal and Ayfer Saraç
935
Erratum
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis
Yi-Shao Lai and Chin-Li Kao