1035-1043
Overshoot Graded Layers for Mismatched Heteroepitaxial Devices
J.F. Ocampo, E. Suarez, F.C. Jain and J.E. Ayers
1044-1048
Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes
W. Wang, A. Lin and J.D. Phillips
1049-1053
Optical Properties of Nanocrystalline GaN Films Prepared
by Annealing Amorphous GaN in Ammonia
Z.X. Zhang, X.J. Pan, T. Wang, L. Jia and L.X. Liu, et al.
1054-1057
MOCVD Growth of InN on Si(111) with Various Buffer Layers
C.C. Huang, R.W. Chuang, S.J. Chang, J.C. Lin and Y.C. Cheng, et al.
1058-1063
Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation
Qifeng Han, Chenghong Duan, Changjian Ji, Kai Qiu and Fei Zhong, et al.
1064-1069
Cleaved Mirrors for Nitride Semiconductor Lasers
Wei-Li Chen and Yi-Cheng Chang
1070-1075
Characterization of Mg-Doped AlInN Annealed in Nitrogen
and Oxygen Ambients
A.T. Cheng, Y.K. Su, W.C. Lai, Y.Z. Chen and S.Y. Kuo
1076-1081
Growth of GaN Nanowires on Epitaxial GaN
D. Aurongzeb, D.Y. Song, G. Kipshidze, B. Yavich and L. Nyakiti, et al.
1082-1087
Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires
Wei Hao Lai, Min Hsiung Hon, Lay Gaik Teoh, Yen Hsun Su and Jiann Shieh, et al.
1088-1094
Combined Use of Magnetic and Electrically Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding
Junhua Wu and D.D.L. Chung
1095-1101
Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking
W. Zhang and W. Ruythooren
1102-1110
Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide
H.J. Lee and Jin Yu
1111-1118
Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions
Ja-Young Jung, Shin-Bok Lee, Ho-Young Lee, Young-Chang Joo and Young-Bae Park
1119-1129
Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates
H.F. Zou and Z.F. Zhang
1130-1138
Intermetallics Characterization of Lead-Free Solder Joints
under Isothermal Aging
Anupam Choubey, Hao Yu, Michael Osterman, Michael Pecht and Fu Yun, et al.
1139-1147
Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects
Seungbae Park, Ramji Dhakal and Jia Gao
1148-1157
Characterization of Self-Formed Ti-Rich Interface Layers
in Cu(Ti)/Low-k Samples
Kazuyuki Kohama, Kazuhiro Ito, Susumu Tsukimoto, Kenichi Mori and Kazuyoshi Maekawa, et al.
1158-1162
Evaluation of Mn Uniformity in CdMnTe Crystal Grown
by the Vertical Bridgman Method
Jijun Zhang, Wanqi Jie, Lijun Luan, Tao Wang and Dongmei Zeng
1163
Erratum
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag
Erratum to Vol. 37, No. 3, March 2008
Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou and Jong-Hyeong Kim