1
Foreword
Sinn-wen Chen, Srinivas Chada, Chih-ming Chen, Hans Flandorfer and A. Lindsay Greer, et al.
2-9
Open AccessMicrostructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap
I. Ohnuma, T. Saegusa, Y. Takaku, C.P. Wang and X.J. Liu, et al.
10-24
Cu-Ni-Sn: A Key System for Lead-Free Soldering
C. Schmetterer, H. Flandorfer, Ch. Luef, A. Kodentsov and H. Ipser
25-32
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder
S.C. Yang, W.C. Chang, Y.W. Wang and C.R. Kao
33-38
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu
Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character
S. Terashima, T. Kohno, A. Mizusawa, K. Arai and O. Okada, et al.
39-45
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM
Dong Hoon Kim, Moon Gi Cho, Sun-Kyoung Seo and Hyuck Mo Lee
46-53
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate
Bo-In Noh and Seung-Boo Jung
54-60
Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate
Yoshikazu Takaku, Komei Makino, Keita Watanabe, Ikuo Ohnuma and Ryosuke Kainuma, et al.
61-69
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow
Chih-hao Chen, Chi-pu Lin and Chih-ming Chen
70-77
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu
Flip-Chip Solder Joints under High Current Density
Sang-Su Ha, Jong-Woong Kim, Jeong-Won Yoon, Sang-Ok Ha and Seung-Boo Jung
78-87
Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations
Aditya Kumar, Ying Yang, Chee C. Wong, Vaidhyanathan Kripesh and Zhong Chen
88-92
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
R. S. Lai, K. L. Lin and B. Salam
93-99
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates
Yee-Wen Yen, Wei-Kai Liou, Hong-Yao Wei and Chiapyng Lee
100-107
Thermal Stability Study of Cu(MoN
x
) Seed Layer
on Barrierless Si
J.P. Chu, C.H. Lin, W.K. Leau and V.S. John
108-112
Reflectivity and Abnormal Absorption at ITO/Al Interface
Y.H. Lin and C.Y. Liu
113-118
Phase Transitions in the BiVO4-
n
PbO (
n
= 1, 2) System: Structural–Electrical Properties Relationships
Jean-Pierre Wignacourt, Michel Drache, Olfa Labidi and Pascal Roussel
119-125
Optical Characteristics of ZnTeO Thin Films Synthesized
by Pulsed Laser Deposition and Molecular Beam Epitaxy
W. Wang, W. Bowen, S. Spanninga, S. Lin and J. Phillips
126-144
Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe
Derek S. Bale and Csaba Szeles
145-152
Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process
Chung-Chieh Yang, Chia-Feng Lin, Jen-Hao Chiang, Hsun-Chih Liu and Chun-Min Lin, et al.
153-158
Nearly Perfect Electrical Activation Efficiencies
from Silicon-Implanted Al
x
Ga1−
x
N with High
Aluminum Mole Fraction
E.A. Moore, Y.K. Yeo, Mee-Yi Ryu and R.L. Hengehold
159-163
A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst
Akihisa Kubota, Keita Yagi, Junji Murata, Heiji Yasui and Shiro Miyamoto, et al.
164-174
Ceramic Substrates for High-temperature Electronic Integration
N. Chasserio, S. Guillemet-Fritsch, T. Lebey and S. Dagdag
175-192
Factors That Govern the Performance of Thermal Interface Materials
Parisa Pour Shahid Saeed Abadi, Chia-Ken Leong and D.D.L. Chung
193-199
Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source
Chih-ming Chen, Po-yuan Shih and Yi-wei Lin
200-207
A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu
Li-ling Yan, Cheng-kuo Lee, Da-quan Yu, Ai-bin Yu and Won-Kyoung Choi, et al.
208
Erratum
Simulation, Modeling, and Crystal Growth of Cd0.9Zn0.1Te for Nuclear Spectrometers
Erratum to Volume 35, Number 6, June 2006, pp. 1251–1256
Krishna C. Mandal, Sung Hoon Kang, Michael Choi, Job Bello and Lili Zheng, et al.