2023-2032
Passivation of Interfacial States for GaAs- and
InGaAs/InP-Based Regrown Nanostructures
M. K. Rathi, G. Tsvid, A. A. Khandekar, J. C. Shin and D. Botez, et al.
2033-2045
Thermodynamic Descriptions for the Cd-Te, Pb-Te, Cd-Pb and Cd-Pb-Te Systems
Yajun Liu, Lijun Zhang and Di Yu
2046-2051
Effect of Colloidal Silver on Optical Transmittance Characteristics of Bulk Cadmium Zinc Telluride Crystals
R. Raman, Ashok Kumar Kapoor, Shiv Kumar and Akhilesh Pandey
2052-2062
Open AccessOn the Mechanisms Governing Aluminum-Mediated
Solid-Phase Epitaxy of Silicon
Yann Civale, Guglielmo Vastola, Lis K. Nanver, Rani Mary-Joy and Jae-Ryoung Kim
2063-2068
Thermal Stability of Ge2Sb2Te5 in Contact with Ti and TiN
Vijayaharan A. Venugopal, Giampiero Ottaviani, Camillo Bresolin, Davide Erbetta and Alberto Modelli, et al.
2069-2084
Rheological Behavior of Thermal Interface Pastes
Chuangang Lin and D. D. L. Chung
2085-2095
In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples
Dominik Herkommer, Michael Reid and Jeff Punch
2096-2105
Experimental Investigation and Thermodynamic Assessment of Phase Equilibria in the Ag-Au-Sn System
F. Gao, C.P. Wang, Y.Y. Li, X.J. Liu and Y. Takaku, et al.
2106-2111
Open AccessFluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
Pin J. Wang, Jong S. Kim and Chin C. Lee
2112-2121
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions
Hwa-Teng Lee, Choo-Yeow Lee, Fok-Foo Lee, Yin-Fa Chen and Yang-Hsien Lee
2122-2131
A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques
V. Sivasubramaniam, M. Galli, J. Cugnoni, J. Janczak-Rusch and J. Botsis
2132-2147
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions
Ning Zhang, Yaowu Shi, Yongping Lei, Zhidong Xia and Fu Guo, et al.
2148-2157
Influence of Lanthanum Additions on the Microstructure
and Microhardness of Sn-3.5Ag Solder
Hwa-Teng Lee and Yin-Fa Chen
2158-2169
Thermodynamic Assessment of the Au-Co-Sn Ternary System
H. Q. Dong, S. Jin, L. G. Zhang, J. S. Wang and X. M. Tao, et al.
2170-2178
Generation of Tin(II) Oxide Crystals on Lead-Free Solder
Joints in Deionized Water
Hong Chang, Hongtao Chen, Mingyu Li, Ling Wang and Yonggao Fu
2179-2183
Size and Volume Effects on the Strength of Microscale
Lead-Free Solder Joints
L.M. Yin, X.P. Zhang and Chunsheng Lu
2184-2193
Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints
W. H. Wu, S. P. Peng, C. S. Lin and C. E. Ho
2194-2200
Abnormal Failure Behavior of Sn-3.5Ag Solder Bumps Under Excessive Electric Current Stressing Conditions
Jang-Hee Lee and Young-Bae Park
2201-2206
A Numerical Simulation of Nanostructure Formation Utilizing Electromigration
Kazuhiko Sasagawa, Shota Fukushi, Yuxin Sun and Masumi Saka
2207-2210
Water-Induced Degradation in (Bi1/2Na1/2)TiO3 Lead-Free Ceramics
Y. H. Gu, W. P. Chen, J. Q. Qi, H. Y. Tian and Y. Wang, et al.