2427-2428
Foreword
Sung K. Kang, Iver Anderson, Srini Chada, Jeng-Gong Duh and Laura J. Turbini, et al.
2429-2435
Heterogeneous Intragranular Inelastic Behavior
of a Sn-Ag-Cu Alloy
Jicheng Gong, Paul P. Conway, Changqing Liu and Vadim V. Silberschmidt
2436-2442
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder
on Ni/Cu Substrate
Jagjiwan Mittal, Shih-Ming Kuo, Yu-Wei Lin and Kwang-Lung Lin
2443-2448
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration
in Flip-Chip Sn-0.7Cu Solder Joints
S. W. Liang, Hsiang-Yao Hsiao, Chih Chen, Luhua Xu and K. N. Tu, et al.
2449-2454
Effect of Wet Pretreatment on Interfacial Adhesion Energy
of Cu-Cu Thermocompression Bond for 3D IC Packages
Eun-Jung Jang, Seungmin Hyun, Hak-Joo Lee and Young-Bae Park
2455-2460
Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment
Kyoung-Jin Min, Sung-Cheol Park, Kyu Hwan Lee, Yongsoo Jeong and Young-Bae Park
2461-2469
The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu
and Ni(P) Under Bump Metallurgy
Sun-Kyoung Seo, Sung K. Kang, Moon Gi Cho, Da-Yuan Shih and Hyuck Mo Lee
2470-2478
Influence of Thermal Cycling on the Thermal Resistance
of Solder Interfaces
H.Y. Guo, J.D. Guo and J.K. Shang
2479-2488
Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates
M. E. Alam, S. M. L. Nai and M. Gupta
2489-2495
Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test
Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jong-Woong Kim and Jeong-Won Yoon, et al.
2496-2505
Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing
Chia-Yen Tan and Jenq-Gong Duh
2506-2515
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings
John P. Daghfal, P. J. Shang, Z. Q. Liu and J. K. Shang
2516-2524
Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating
Aleksandra Dimitrovska and Radovan Kovacevic
2525-2533
Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering
M. S. Park and R. Arróyave
2534-2542
Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder
with Ti/Ni(V)/Cu Underbump Metallization
During Aging
Kai-Jheng Wang and Jenq-Gong Duh
2543-2553
Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization After Various Reflows
Chung-Nan Peng and Jenq-Gong Duh
2554-2562
Inhomogeneous Consumption of the Electroless Ni-P Layer
at the Solder Joint Formed with Sn-3.5Ag-0.7Cu
Yong-Jun Oh and Sung-Yong Oh
2563-2572
The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples
W.H. Wu, H.L. Chung, C.N. Chen and C.E. Ho
2573-2578
Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders
Y. H. Hsiao, H. W. Tseng and C. Y. Liu
2579-2584
TEM Observations of the Growth of Intermetallic Compounds
at the SnBi/Cu Interface
P. J. Shang, Z. Q. Liu, D. X. Li and J. K. Shang
2585-2591
Open AccessThe Interaction Between an Imposed Current and the Creep
of Idealized Sn-Ag-Cu Solder Interconnects
Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu and J. W. Morris
2592-2599
ENIG Corrosion Induced by Second-Phase Precipitation
John Osenbach, Ahmed Amin, Frank Baiocchi and John DeLucca
2600-2609
Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting
John L. Wagner, Peter F. Ladwig, Doug P. Riemer and Galen Houk
2610-2616
Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles
Hiroshi Nishikawa, Yoshihito Hamada and Tadashi Takemoto
2617-2627
Correlations Between the Microstructure and Fatigue Life
of Near-Eutectic Sn-Ag-Cu Pb-Free Solders
Babak Arfaei and Eric Cotts
2628-2646
Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework
Polina Snugovsky, Zohreh Bagheri and Craig Hamilton
2647-2658
Effect of Electromigration and Isothermal Aging
on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films
Fu Guo, Guangchen Xu, Hongwen He, Mengke Zhao and Jia Sun, et al.
2659-2667
Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints
Takayuki Kobayashi, Andre Lee and K. N. Subramanian
2668-2675
Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier
Seongjun Kim, Keun-Soo Kim, Sun-Sik Kim, Katsuaki Suganuma and Goro Izuta
2676-2684
Open AccessFinite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound
Eric Buchovecky, Nitin Jadhav, Allan F. Bower and Eric Chason
2685-2693
Open AccessMicrostructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu
Solder Joints
Tae-Kyu Lee, Kuo-Chuan Liu and Thomas R. Bieler
2694-2701
Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s
Thomas R. Bieler and Adwait U. Telang
2702-2711
Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear
Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee and Kuo-Chuan Liu
2712-2719
Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free
Solder Joints Using Synchrotron Radiation
Thomas R. Bieler, Tae-kyu Lee and Kuo-Chuan Liu
2720-2725
Open AccessInvestigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology
Teymur Bakhishev and Vivek Subramanian
2726-2734
The Effect of Micro-Alloying of Sn Plating on Mitigation
of Sn Whisker Growth
Aleksandra Dimitrovska and Radovan Kovacevic
2735-2745
Liquid Phase Sintered Solders with Indium as Minority Phase
for Next Generation Thermal Interface Material Applications
I. Dutta, R. Raj, P. Kumar, T. Chen and C. M. Nagaraj, et al.
2746-2755
Mechanical Shock Behavior of Bulk Pure Sn Solder
K. E. Yazzie, H. Fei, J. J. Williams, H. Jiang and N. Chawla
2756-2761
Resistance Changes in Eutectic Sn-Bi Solder Joints
During Electromigration
Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia and Yongping Lei, et al.
2762-2769
Evaluations of Whisker Growth and Fatigue Reliability
of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages
Tung-Han Chuang, Chih-Yuan Cheng and Tao-Chih Chang
2770-2779
Nucleation Control and Thermal Aging Resistance
of Near-Eutectic Sn-Ag-Cu-X Solder Joints
by Alloy Design
Iver E. Anderson, Jason W. Walleser, Joel L. Harringa, Fran Laabs and Alfred Kracher
2780-2785
Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration
Albert T. Wu and K.H. Sun
2786
Erratum
Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays
Erratum to Volume 38, Number 11, November 2009, pp. 2308–2313
Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Meng-Kai Shih and Yi-Shao Lai, et al.