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Volume 1 / 1990 - Volume 27 / 2011
307
Editorial
Vishwani D. Agrawal
309-310
Test Technology Newsletter August 2006 The Newsletter of the Test Technology Technical Council of the IEEE Computer SocietyEditor: Bruce Kim
311
Guest Editorial
Salvador Mir, Tim Cheng and Andrew Richardson
313-324
Test Development Through Defect and Test Escape Level Estimation for Data Converters
Carsten Wegener and Michael Peter Kennedy
325-335
A BIST Scheme for SNDR Testing of ΣΔ ADCs Using Sine-Wave Fitting
Luis Rolíndez, Salvador Mir, Ahcéne Bounceur and Jean-Louis Carbonéro
337-350
Next Generation ADC Massive Parallel Testing with Real Time Parameter Evaluation
Heinz Mattes, Stéphane Kirmser and Sebastian Sattler
351-357
A First Step for an INL Spectral-Based BIST: The Memory Optimization
V. Kerzérho, S. Bernard, P. Cauvet and J. M. Janik
359-370
Investigation into the Use of Hybrid Solutions for ΣΔ A/D Converter Testing
K. Georgopoulos, A. Lechner, M. Burbidge and A. Richardson
371-386
Towards Fault-Tolerant RF Front Ends
Tejasvi Das, Anand Gopalan, Clyde Washburn and P. R. Mukund
387-398
On-Chip Random Jitter Testing Using Low Tap-Count Coarse Delay Lines
Jiun-Lang Huang
399-409
Structural Fault Modeling and Fault Detection Through Neyman–Pearson Decision Criteria for Analog Integrated Circuits
Amir Zjajo, Jose Pineda de Gyvez and Guido Gronthoud
411-423
Proposal of Fault Diagnosis of Analog Circuits by Combining Operation-Region Model and X–Y Zoning Method: Case Study
Yukiya Miura
425-436
TBSA: Threshold-Based Simulation Accuracy Method for Fast Analog DC Fault Simulation
Michel Morneau and Abdelhakim Khouas
437-448
A 1-MHz Area-Efficient On-Chip Spectrum Analyzer for Analog Testing
M. A. Domínguez, J. L. Ausín, J. F. Duque-Carrillo and G. Torelli
449-462
Built-In-Self-Testing Techniques for Programmable Capacitor Arrays
Amit Laknaur, Sai Raghuram Durbha and Haibo Wang
463-470
Embedded System Level Self-Test for Mixed-Signal IO Verification
V. Loukusa
471-482
Lifetime Prediction and Design-for-Reliability of IC Interconnections with Electromigration Induced Degradation in the Presence of Manufacturing Defects
Xiangdong Xuan, Adit D. Singh and Abhijit Chatterjee
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