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Volume 1 / 1993 - Volume 12 / 2004
Now merged into Journal of Materials Science (1966-2012)
5
Editorial Board
Editorial: Short-Circuit Diffusion at Interfaces in Materials
Yuri Mishin
7-20
Diffusion, Solute Segregations and Interfacial Energies in Some Material: An Overview
D. Gupta
21-31
Grain Boundary Diffusion and Linear and Non-Linear Segregation of Ag in Cu
Sergiy Divinski, Maik Lohmann and Christian Herzig
33-40
Effect of Grain Boundary Segregation and Migration on Diffusion Profiles: Analysis and Experiments
J. Bernardini, Ch. Girardeaux, A. Rolland and D.L. Beke
41-49
Grain Boundary Diffusion and Segregation in Interstitial Solid Solutions Based on BCC Transition Metals: Carbon in Niobium
B. Bokstein and I. Razumovskii
51-58
Diffusion Along Migrating Grain Boundaries
P. Zieba
59-66
Effects of Metastable Diffusion Short-Circuits on Surface Segregation
René Le Gall and Guy Saindrenan
67-80
Tracer Diffusion of 63Ni in Nano-γ-FeNi Produced by Powder Metallurgical Method: Systematic Investigations in the C, B, and A Diffusion Regimes
S.V. Divinski, F. Hisker, Y.-S. Kang, J.-S. Lee and Chr. Herzig
81-90
Short-Circuit Diffusion in Ceramics
J.H. Harding
91-97
The Lattice Model for Addressing Phenomenological Diffusion Problems Associated with Grain Boundaries
G.E. Murch and I.V. Belova
99-109
An Atomistic Study of Interfacial Diffusion in Lamellar TiAl Alloys
M. Nomura and V. Vitek
111-120
Effect of High-Temperature Structure and Diffusion on Grain-Boundary Diffusion Creep in fcc Metals
P. Keblinski and V. Yamakov
121-129
Modeling of Surface Diffusion in hcp Zr and Ti
M.I. Pascuet, J.R. Fernández, R.C. Pasianot and A.M. Monti
131-148
Atomistic Modeling of Point Defects and Diffusion in Copper Grain Boundaries
A. Suzuki and Y. Mishin
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