Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Montreux, Switzerland, 12-14 May 2004
1
Editorial
Design, Test, Integration and Packaging of MEMS/MOEMS, 2004
Bernd Michel
2-7
Technical paper
Super-fine ink-jet printing: toward the minimal manufacturing system
Kazuhiro Murata, Junichi Matsumoto, Akira Tezuka, Yorishige Matsuba and Hiroshi Yokoyama
8-14
Technical paper
Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirror
Fabien Parrain, Souhil Megherbi, Gilles Raynaud, Hervé Mathias and Jean-Paul Gilles, et al.
15-20
Technical paper
V-shaped micromechanical tunable capacitors for RF applications
Aurélie Cruau, Gaëlle Lissorgues, Pierre Nicole, Dominique Placko and Adrian M. Ionescu
21-29
Technical paper
A methodology to extract dynamic compact thermal models under time-varying boundary conditions: application to a thermopile based IR sensor
M. Salleras, J. Palacín, M. Moreno, J. Santander and L. Fonseca, et al.
30-37
Technical paper
Fabrication and optimization of bimorph micro probes for the measurement of individual biocells
Y. H. Cho, D. Collard, L. Buchaillot, F. Conseil and B. J. Kim
38-43
Technical paper
Behavioral VHDL-AMS model and experimental validation of a nuclear magnetic resonance sensor
S. Megherbi, J.-C. Ginefri, L. Darrasse, G. Raynaud and J.-F. Pône
44-51
Technical paper
Electronic Mosquito: designing a semi-invasive Microsystem for blood sampling, analysis and drug delivery applications
Giorgio E. Gattiker, Karan V. I. S. Kaler and Martin P. Mintchev
52-58
Technical paper
MOEMS: packaging and testing
Z. F. Wang, W. Cao and Z. Lu
59-62
Technical paper
Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks
S. Brida, S. Metivet, D. Petit and O. Stojanovic
63-68
Technical paper
Glass frit bonding: an universal technology for wafer level encapsulation and packaging
Roy Knechtel
69-74
Technical paper
The influence of package-induced stresses on moulded Hall sensors
Sebastian Fischer, Harald Beyer, Ralf Janke and Jürgen Wilde
75-81
Technical paper
Thermo-mechanical analysis of advanced electronic packages in early system design
Johann-Peter Sommer, Olaf Wittler, Dionysios Manessis and Bernd Michel
82-90
Technical paper
Fabrication of microlens array with graduated sags using UV proximity printing method
H. Yang, C.-K. Chao, T.-H. Lin and C.-P. Lin
91-97
Technical paper
Tunable Fabry-Perot surface micromachined interferometer-experiments and modeling
Raluca Müller, Dana Cristea, C. Tibeica, P. Arguel and P. Pons, et al.
98-103
Technical paper
Fabrication of an accurately vertical sidewall for optical switch applications using deep RIE and photoresist spray coating
T. Ikehara and R. Maeda
104-109
Technical paper
Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser
C. K. Chung and Y. C. Lin
110-115
Technical paper
Large-scale hot embossing
M. Worgull, M. Heckele and W. K. Schomburg
116-119
Technical paper
A study of integration of LIGA and M-EDM technology on the microinjection molding of ink-jet printers’ nozzle plates
Shi-Chang Tseng, Yi-Chern Chen, Chia-Lung Kuo and Bow-Yuen Shew
120-127
Technical paper
Bio-MEMS fabricated artificial capillaries for tissue engineering
G. J. Wang, C. L. Chen, S. H. Hsu and Y. L. Chiang
128-136
Technical paper
A 3D-CAM system for quick prototyping and microfabrication using excimer laser micromachining
Emir Mutapcic, Pio Iovenitti and Jason P. Hayes
137-142
Technical paper
Feature length-scale modeling of LPCVD and PECVD MEMS fabrication processes
Lawrence C. Musson, Pauline Ho, Steven J. Plimpton and Rodney C. Schmidt
143-148
Technical paper
Preparation of ferroelectric ceramics in a film structure and their photovoltaic properties
M. Ichiki, Y. Morikawa, Y. Mabune, T. Nakada and K. Nonaka, et al.
149-153
Technical paper
Reliability study of AlTi/TiW on polysilicon contacts for high temperature sensors
A. Andrei, C. Malhaire, S. Brida, J. M. Dujardin and D. Barbier, et al.
154-159
Technical paper
Transient thermal characterisation of hot plates
Gy. Bognár, P. Fürjes, V. Székely and M. Rencz
160-168
Technical paper
SOI-CMOS compatible low-power gas sensor using sputtered and drop-coated metal-oxide active layers
P. Ivanov, J. Laconte, J. P. Raskin, M. Stankova and E. Sotter, et al.
169-172
Technical paper
Stable SOI micromachined electrostatic AC voltage reference
Anu Kärkkäinen, Panu Pekko, James Dekker, Nadine Pesonen and Mika Suhonen, et al.
173-179
Technical paper
Integrated electromagnetic microactuators with a large driving force
C.-T. Pan, H. Yang, M.-C. Chou and S.-C. Shen
180-185
Technical paper
Development of a low cost hybrid Si/PDMS multi-layered pneumatic microvalve
Gaël Thuillier and Chantal Khan Malek