Special issue: Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11-12 October 2004, Halle
377
Foreword
Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle
Bernd Michel and Jörg Bagdahn
378-382
Technical paper
Surface plasma treatments enabling low temperature direct bonding
Hubert Moriceau, François Rieutord, Christophe Morales and Anne Marie Charvet
383-390
Technical paper
Effect of interfacial SiO2 thickness for low temperature O2 plasma activated wafer bonding
Benoit Olbrechts, Xuanxiong Zhang, Yannick Bertholet, Thomas Pardoen and Jean-Pierre Raskin
391-396
Technical paper
Direct bonding with on-wafer metal interconnections
C. Jia, M. Wiemer and T. Gessner
397-400
Technical paper
Wafer direct bonding with ambient pressure plasma activation
Markus Gabriel, Brad Johnson, Ralf Suss, Manfred Reiche and Marko Eichler
401-405
Technical paper
Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)
H. Luoto, T. Suni, M. Kulawski, K. Henttinen and H. Kattelus
406-412
Technical paper
Bonded thick film SOI with pre-etched cavities
Tommi Suni, Kimmo Henttinen, James Dekker, Hannu Luoto and Martin Kulawski, et al.
413-417
Technical paper
Discussion of tooling solutions for the direct bonding of silicon wafers
Nick Aitken and Tony Rogers
418-429
Technical paper
Versatile low temperature wafer bonding and bond strength measurement by a blister test method
Alexander Doll, Martin Rabold, Frank Goldschmidtböing and Peter Woias
430-435
Technical paper
Influence of the frequency on fatigue of directly wafer-bonded silicon
Jörg Bagdahn, Michael Bernasch and Matthias Petzold
436-440
Technical paper
Fabrication of microfluidic networks with integrated electrodes
D. C. Hermes, T. Heuser, E. J. van der Wouden, J. G. E. Gardeniers and A. van den Berg
441-449
Technical paper
Anodic bonding of glass to aluminium
K. Schjølberg-Henriksen, E. Poppe, S. Moe, P. Storås and M.M.V. Taklo, et al.
450-454
Technical paper
Fabrication and mechanical testing of glass chips for high-pressure synthetic or analytical chemistry
R. E. Oosterbroek, D. C. Hermes, M. Kakuta, F. Benito-Lopez and J. G. E. Gardeniers, et al.
455-461
Technical paper
Transfer of small structures by bonding
G. Villanueva, J.A. Plaza, E. González and J. Bausells
462-467
Technical paper
A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
R. Knechtel, M. Knaup and J. Bagdahn
468-472
Technical paper
Wafer level encapsulation of microsystems using glass frit bonding
R. Knechtel, M. Wiemer and J. Frömel
473-480
Technical paper
Mechanical properties of glass frit bonded micro packages
C. Dresbach, A. Krombholz, M. Ebert and J. Bagdahn
481-483
Technical paper
Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
J. Frömel, D. Billep, T. Geßner and M. Wiemer