1119
Editorial
Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Bernard Courtois and Bernd Michel
1121-1128
Technical Paper
Experimental validation of compact damping models of perforated MEMS devices
Timo Veijola, Giorgio De Pasquale and Aurelio Somà
1129-1139
Technical Paper
Frequency-dependent noise analysis and damping in MEMS
Mrigank Sharma and Edmond Cretu
1141-1148
Technical Paper
Trapping of cells by insulator-based dielectrophoresis using open-top microstructures
Chun-Ping Jen and Teng-Wen Chen
1149-1156
Technical Paper
Hot roller embossing for microfluidics: process and challenges
S. H. Ng and Z. F. Wang
1157-1162
Technical Paper
Microfluidic device for continuous magnetophoretic separation of white blood cells
Ciprian Iliescu, Guolin Xu, Elena Barbarini, Marioara Avram and Andrei Avram
1163-1169
Technical Paper
High quality factor silicon cantilever driven by piezoelectric thin film actuator for resonant based mass detection
Jian Lu, Tsuyoshi Ikehara, Yi Zhang, Takashi Mihara and Toshihiro Itoh, et al.
1171-1177
Technical Paper
Design and fabrication of novel micro electromagnetic actuator
Chia-Yen Lee, Zgen-Hui Chen, Hsien-Tseng Chang, Chih-Yung Wen and Chiang-Ho Cheng
1179-1186
Technical Paper
A single chip, double channel thermal flow meter
P. Bruschi, M. Dei and M. Piotto
1187-1193
Technical Paper
Micro-hotplate based temperature stabilization system for CMOS SAW resonators
Anis Nurashikin Nordin, Ioana Voiculescu and Mona Zaghloul
1195-1199
Technical Paper
A microwave probe nanostructure for atomic force microscopy
Y. Ju, M. Hamada, T. Kobayashi and H. Soyama
1201-1205
Technical Paper
A microcantilever-based gas flow sensor for flow rate and direction detection
Rong-Hua Ma, Po-Cheng Chou, Yu-Hsiang Wang, Tzu-Han Hsueh and Lung-Ming Fu, et al.
1207-1216
Technical Paper
Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS
Chi-Jia Tong and Ming-Tzer Lin
1217-1223
Technical Paper
Linear and non-linear behavior of mechanical resonators for optimized inertial electromagnetic microgenerators
C. Serre, A. Pérez-Rodríguez, N. Fondevilla, E. Martincic and J. R. Morante, et al.
1225-1232
Technical Paper
Study on micro hot embossing of low temperature co-firable ceramic green substrates
Xuechuan Shan, H. P. Maw, S. H. Ling and Y. C. Lam
1233-1243
Technical Paper
Design methodology and fabrication process of a microinductor for the next generation of DC–DC power converters
David Flynn and Marc P. Y. Desmulliez
1245-1254
Technical Paper
Megasonic agitation for enhanced electrodeposition of copper
Jens Georg Kaufmann, Marc P. Y. Desmulliez, Yingtao Tian, Dennis Price and Mike Hughes, et al.
1255-1261
Technical Paper
New high fill-factor triangular microlens array fabrication method using UV proximity printing
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao and Shih-Yu Hung
1263-1264
Erratum
New high fill-factor triangular microlens array fabrication method using UV proximity printing
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao and Shih-Yu Hung
1265-1271
Technical Paper
Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks
Ruey Fang Shyu, Hsiharng Yang and Jun-Han Lee
1273-1277
Technical Paper
A low-cost through via interconnection for ISM WLP
Jingli Yuan, Won-Kyu Jeung, Chang-Hyun Lim, Seung-Wook Park and Young-Do Kweon, et al.
1279-1285
Technical Paper
Contactless thermal characterization of high temperature test chamber
György Bognár, Z. Szűcs, V. Székely and M. Rencz
1287-1291
Technical Paper
Processing and characterisation of precision microparts from nickel-based materials
D. M. Allen, H. J. Almond, K. Bedner, M. Cabeza and B. Courtot, et al.
1293-1301
Technical Paper
Characterization and modeling of electro-thermal MEMS structures
Péter Gábor Szabó and Vladimír Székely
1303-1309
Technical Paper
Package hermeticity testing with thermal transient measurements
András Vass-Várnai and Márta Rencz
1311-1317
Technical Paper
Study of mechanical response in micro-indentation of laminated ceramic green substrates
Y. C. Liu and Xuechuan Shan
1319-1325
Technical Paper
A micro roller embossing process for structuring large-area substrates of laminated ceramic green tapes
Xuechuan Shan, Y. C. Soh, C. W. P. Shi, L. Jin and C. W. Lu
1327-1333
Technical Paper
Sub-μm structured lotus surfaces manufacturing
Matthias Worgull, M. Heckele, T. Mappes, B. Matthis and G. Tosello, et al.