1035
Editorial
Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009
Bernard Courtois and Bernd Michel
1037-1043
Technical Paper
Design issues of BAW employment in 3D integrated sensor nodes
Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl and Rainer Matischek, et al.
1045-1049
Technical Paper
Through-silicon via technologies for interconnects in RF MEMS
Jian Zhu, Yuanwei Yu, Fang Hou and Chen Chen
1051-1055
Technical Paper
3D System-on-Chip technologies for More than Moore systems
Peter Ramm, Armin Klumpp, Josef Weber and Maaike M. V. Taklo
1057-1064
Technical Paper
Mechanical modelling of capacitive RF MEMS shunt switches
Romolo Marcelli, Andrea Lucibello, Giorgio De Angelis, Emanuela Proietti and Daniele Comastri
1065-1071
Technical Paper
Optimal design analysis of electrothermally driven microactuators
Seyed Majid Karbasi, Mahnaz Shamshirsaz, Mahyar Naraghi and Mohammad Maroufi
1073-1079
Technical Paper
Modeling of an electrostatic torsional micromirror for laser projection system
Eleonora Marchetti, Emilio Volpi, Francesco Battini, Luca Bacciarelli and Luca Fanucci, et al.
1081-1090
Technical Paper
Effect of dimensional and material property uncertainties on thermal flexure microactuator response using probabilistic methods
Babak Khayatzadeh Safaie, Mahnaz Shamshirsaz and Mohsen Bahrami
1091-1096
Technical Paper
Effects of channel surface finish on blood flow in microfluidic devices
S. Prentner, D. M. Allen, L. Larcombe, S. Marson and K. Jenkins, et al.
1097-1104
Technical Paper
Hydrodynamic separation of cells utilizing insulator-based dielectrophoresis
Chun-Ping Jen, Ching-Te Huang and Hsin-Yuan Shih
1105-1110
Technical Paper
Fabrication of internally driven micro centrifugal force pumps based on synchronous micro motors
Andreas Waldschik and Stephanus Büttgenbach
1111-1118
Technical Paper
Reliability of RF MEMS switches due to charging effects and their circuital modelling
Romolo Marcelli, Giancarlo Bartolucci, George Papaioannu, Giorgio De Angelis and Andrea Lucibello, et al.
1119-1129
Technical Paper
Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Krystan Marquardt, Robert Hahn, Martin Blechert, Marco Lehmann and Michael Töpper, et al.
1131-1137
Technical Paper
Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS
Chi-Jia Tong, Ya-Chi Cheng, Ming-Tzer Lin, Kuan-Jung Chung and Jiong-Shiun Hsu, et al.
1139-1156
Technical Paper
Design of CWDM multiplexers based on series coupled ring resonators: analysis, potential and prospects on MEMS fabrication technologies
Maurine Malak, Ahmed Hisham Morshed, Khaled Hassan, Tarik Bourouina and Hanan Anis, et al.
1157-1164
Technical Paper
Experimental study of heat sink performance using copper foams fabricated by electroforming
Reiyu Chein, Hsiharng Yang, Tsung-Hsun Tsai and Chijay Lu
1165-1174
Technical Paper
Fabrication methods based on wet etching process for the realization of silicon MEMS structures with new shapes
Prem Pal and Kazuo Sato
1175-1179
Technical Paper
A novel CMOS process compatible high performance parallel-stacked RF spiral inductor
D. K. Jair, Ming Chun Hsieh and C. S. Lin
1181-1186
Technical Paper
Corona discharge assisted thermal bonding of polymer microfluidic devices
Sum Huan Ng, Yexian Wu, Zhenfeng Wang and Zhiping Wang
1187-1192
Technical Paper
Novel design of a RF-MEMS tuneable capacitor based on electrostatically induced torsion
Parisa Ture Savadkoohi, Sabrina Colpo and Benno Margesin
1193-1200
Technical Paper
Integration of stamper fabrication and design optimization of LCD Light guides using silicon-based microfeatures
Jyh-Cheng Yu and Pei-Kai Hsu
1201-1206
Technical Paper
Hot punching on an 8 inch substrate as an alternative technology to produce holes on a large scale
Bastian E. Rapp, Marc Schneider and Matthias Worgull
1207-1214
Technical Paper
Novel U-shape gold nanoparticles-modified optical fiber for localized plasmon resonance chemical sensing
Chien-Hsing Chen, Tzu-Chien Tsao, Wan-Yun Li, Wei-Chih Shen and Chung-Wei Cheng, et al.
1215-1220
Technical Paper
New fabrication method for micro-pyramidal vertical probe array for probe cards
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao and Mau-Shiun Yeh
1221-1231
Technical Paper
Microthermoforming of nanostructured polymer films: a new bonding method for the integration of nanostructures in 3-dimensional cavities
Markus Heilig, Stefan Giselbrecht, Andreas Guber and Matthias Worgull
1233-1237
Technical Paper
Properties of M-AFM probe affected by nanostructural metal coatings
A. Hosoi, M. Hamada, A. Fujimoto and Y. Ju
1239-1242
Technical Paper
Use of a PDMS spring element for ink jet printing applications
S. Bargir and David M. Allen
1243-1249
Technical Paper
Temperature dependent fracture toughness of glass frit bonding layers
Kerstin Nötzold, Christian Dresbach, Jürgen Graf and Bianca Böttge
1251-1257
Technical Paper
Identification of mechanical defects in MEMS using dynamic measurements for application in production monitoring
Ronny Gerbach, Matthias Ebert, Geert Brokmann, Thomas Hein and Joerg Bagdahn
1259-1268
Technical Paper
MEMS cantilever sensor for non-destructive metrology within high-aspect-ratio micro holes
Erwin Peiner and Lutz Doering
1269-1276
Technical Paper
A microvalve for hybrid microfluidic systems
G. Simone, G. Perozziello, G. Sardella, I. Disegna and S. Tori, et al.
1277-1284
Technical Paper
MEMS packaging process by film transfer using an anti-adhesive layer
Sebastien Brault, O. Garel, G. Schelcher, N. Isac and F. Parrain, et al.