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Journal Issue
Volume 32, Number 12 / December, 2003
Journal
Journal of Electronic Materials
Publisher
Springer Boston
ISSN
0361-5235 (Print) 1543-186X (Online)
Pages
1359-1546
Subject Collection
Chemistry and Materials Science
SpringerLink Date
Saturday, April 07, 2007
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28 Articles
First
|
1-10
|
11-20
|
21-28
|
Next
Article
Foreword
James P. Lucas
,
Srini Chada
,
Sung K. Kang
,
C. Robert Kao
,
Kwang-Lung Lin
,
Jud Ready
and
Jin Yu
PDF (27.0 KB)
1359
Article
Packaging of nanostructured microelectromechanical systems microtriode devices
L. H. Chen
and
S. Jin
PDF (135.7 KB)
1360-1365
Article
Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging
Sungho Jin
PDF (112.1 KB)
1366-1370
Article
Temperature and duration effects on microstructure evolution during copper wafer bonding
K. N. Chen
,
A. Fan
,
C. S. Tan
and
R. Reif
PDF (85.5 KB)
1371-1374
Article
Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentation
J. P. Lucas
,
H. Rhee
,
F. Guo
and
K. N. Subramanian
PDF (241.5 KB)
1375-1383
Article
Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity
B. A. Cook
,
I. E. Anderson
,
J. L. Harringa
and
S. K. Kang
PDF (250.0 KB)
1384-1391
Article
Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimen
Kepeng Wu
,
Makoto Aoyama
,
Noboru Wade
,
Jie Cui
,
Shinji Yamada
and
Kazuya Miyahara
PDF (209.4 KB)
1392-1397
Article
The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept
Yoshiharu Kariya
,
Masahisa Otsuka
and
William J. Plumbridge
PDF (96.1 KB)
1398-1402
Article
Influence of initial morphology and thickness of Cu
6
Sn
5
and Cu
3
Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints
X. Deng
,
G. Piotrowski
,
J. J. Williams
and
N. Chawla
PDF (247.4 KB)
1403-1413
Article
Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder
F. Ochoa
,
J. J. Williams
and
N. Chawla
PDF (202.9 KB)
1414-1420
28 Articles
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1-10
|
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|
21-28
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Author
Kwang-Lung Lin
N. Chawla
K. N. Subramanian
Jenq-Gong Duh
L. H. Chen
J. J. Williams
Yoshiharu Kariya
Sung K. Kang
Article Category
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