Superior thermal conductivity, high resistance, high breakdown voltage and wide band gap make diamond an attractive material for a variety of applications in electronics. One of its most appealing applications is as a buried dielectric in silicon-on-diamond (SOD) technology. This paper presents thermal conductivity measurements conducted on a series of diamond films (grown by the microwave plasma chemical vapor deposition technique) as a function of the sample morphology and thickness, for eventual incorporation in the SOD structures. Results show that there is a significant difference in the measured thermal conductivity between samples with fiber texture and samples with sheet texture. Also, measurements performed on a 160-μm-thick diamond sample before and after reactive ion etching of approximately 10 μm of the nucleation layer show no significant change in the measured value of the thermal conductivity.