Journal Article

Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

Y. Nakamura and T. Ono

Journal of Materials Science, 2005, Volume 40, Number 12, Pages 3267-3269

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Journal Article

Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn–0.7%Cu alloy from melt

Samia E. Negm

Journal of Materials Science: Materials in Electronics, 2012, Volume 23, Number 1, Pages 94-99

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Journal Article

Issues related to the implementation of Pb-free electronic solders in consumer electronics

D. R. Frear

Journal of Materials Science: Materials in Electronics, 2007, Volume 18, Numbers 1-3, Pages 319-330

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Journal Article

Tin pest issues in lead-free electronic solders

W. J. Plumbridge

Journal of Materials Science: Materials in Electronics, 2007, Volume 18, Numbers 1-3, Pages 307-318

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Journal Article

Internal friction measurement of tropical species by various acoustic methods

Loïc Brancheriau, Clément Kouchade and Iris Brémaud

Journal of Wood Science, 2010, Volume 56, Number 5, Pages 371-379

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Journal Article

Development of Sn–Zn lead-free solders bearing alloying elements

Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng and Huan Ye, et al.

Journal of Materials Science: Materials in Electronics, 2010, Volume 21, Number 1, Pages 1-15

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Journal Article

Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder

Yu-hua Hu, Song-bai Xue, Hui Wang, Huan Ye and Zheng-xiang Xiao, et al.

Journal of Materials Science: Materials in Electronics, 2011, Volume 22, Number 5, Pages 481-487

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Journal Article

Internal friction and Young’s modulus of Si₃N₄/BN fibrous monoliths at various vibrational strain amplitudes

B. K. Kardashev, B. I. Smirnov, D. Singh, K. C. Goretta and A. R. de Arellano-López

Physics of the Solid State, 2003, Volume 45, Number 3, Pages 477-481

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